Development of a long-cycle data acquisition system based on silicon resonant pressure sensors
Author:
Affiliation:
1. University of Jinan,School of Electrical Engineering,Shandong,China
2. Shandong SIRCAS Technology Co, Ltd.,Shandong,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10291176/10291182/10291701.pdf?arnumber=10291701
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3. Residual stress in thin films PECVD depositions;iliescu;Journal of Optoelectronics and Advanced Materials,2011
4. A high-resolution micro-electro-mechanical resonant tilt sensor
5. Experimental investigation and finite element simulation of laser beam welding induced residual stresses and distortions in thin sheets of AA 6056-T4;nélias;Materials Science and Engineering A,2010
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