Distributed Inference with Deep Learning Models across Heterogeneous Edge Devices
Author:
Affiliation:
1. University of Toronto,Department of Electrical and Computer Engineering
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9796607/9796652/09796896.pdf?arnumber=9796896
Reference20 articles.
1. DeepThings: Distributed Adaptive Deep Learning Inference on Resource-Constrained IoT Edge Clusters
2. Adaptive parallel execution of deep neural networks on heterogeneous edge devices
3. Min-max linear programming and the timing analysis of digital circuits
4. Very deep convolutional networks for large-scale image recognition;simonyan;3rd International Conference on Learning Representations ICLR 2015,2015
5. Sparsification and Separation of Deep Learning Layers for Constrained Resource Inference on Wearables
Cited by 30 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. DIDS: A distributed inference framework with dynamic scheduling capability;Future Generation Computer Systems;2025-01
2. Murmuration: On-the-fly DNN Adaptation for SLO-Aware Distributed Inference in Dynamic Edge Environments;Proceedings of the 53rd International Conference on Parallel Processing;2024-08-12
3. When the Edge Meets Transformers: Distributed Inference with Transformer Models;2024 IEEE 44th International Conference on Distributed Computing Systems (ICDCS);2024-07-23
4. Researching the CNN Collaborative Inference Mechanism for Heterogeneous Edge Devices;Sensors;2024-06-27
5. ChainNet: A Customized Graph Neural Network Model for Loss-Aware Edge AI Service Deployment;2024 54th Annual IEEE/IFIP International Conference on Dependable Systems and Networks (DSN);2024-06-24
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3