Design and performance of a high density 3D microwave module

Author:

Sturdivant R.,Chung Ly ,Benson J.,Hauhe M.

Publisher

IEEE

Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Design of a Tile-Type Rx Multi-Beam Digital Active Phased Array Antenna System;Journal of Electromagnetic Engineering and Science;2022-01-31

2. Design and Implementation of a Ka-Ku Frequency Conversion Receiver 3D SiP Module;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07

3. Impact of Physical Dimensions and Dielectric Materials in Fuzz Button Interconnection Area on Signal Transmission;2021 IEEE 66th Holm Conference on Electrical Contacts (HLM);2021-10-24

4. Design and Implementation of RF Front-End Module Based on 3D Heterogenous-Integrated Wafer-Level Packaging;Electronics;2021-08-06

5. Packaging of Transmit/Receive Modules;RF and Microwave Microelectronics Packaging II;2017

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