Thermal Modelling of Resonant Capacitor Boards for Inductive Power Transfer Systems
Author:
Affiliation:
1. University of Auckland,Department of Electrical, Computer and Software Engineering
2. Fisher & Paykel Healthcare
3. University of Auckland,Centre for Advanced Materials Manufacturing and Design,Auckland,New Zealand
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10557246/10557256/10557396.pdf?arnumber=10557396
Reference11 articles.
1. Modern Trends in Inductive Power Transfer for Transportation Applications
2. Thermal Analysis of a 50 kW Three-Phase Wireless Charging System
3. Thermal Evaluation of an Inductive Power Transfer Pad for Charging Electric Vehicles
4. Steady-State Heat Transfer in Class I MLCCs for Resonant Power Converter Applications
5. Inductive Power Transfer
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