3D-ICE 3.0: efficient nonlinear MPSoC thermal simulation with pluggable heat sink models-Reference-Cited by-同舟云学术

3D-ICE 3.0: efficient nonlinear MPSoC thermal simulation with pluggable heat sink models

Published:2021 Issue: Volume: Page:1-1
ISSN:0278-0070
Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
language:
Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Terraneo Federico¹,Leva Alberto²,Fornaciari William²,Zapater Marina³,Atienza David⁴

Affiliation:

1. Dipartimento di Elettronica, Informazione e Bioingegneria (DEIB), Politecnico di Milano, Italy. (e-mail: federico.terraneo@polimi.it)

2. Dipartimento di Elettronica, Informazione e Bioingegneria (DEIB), Politecnico di Milano, Italy.

3. School of Management and Engineering Vaud (HEIG-VD) at the University of Applied Sciences Western Switzerland (HES-SO), Switzerland.

4. Embedded Systems Lab. (ESL), Swiss Federal Institute of Technology Lausanne (EPFL), Switzerland.

Funder

EC EUROLAB4HPC CSA Grant

ERC Consolidator Grant COMPUSAPIEN

RECIPE EU H2020 Project

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Link

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