Funder
Advanced Research Projects Agency - Energy
U.S. Department of Energy
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Control and Systems Engineering
Cited by
13 articles.
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1. Rapid Prototyping of a SiC-Based PMSM Motor Drive for Aerospace Applications;2023 IEEE Design Methodologies Conference (DMC);2023-09-24
2. Topology Optimized Fin Designs for Base Plate Direct-Cooled Multi-Chip Power Modules;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
3. Data Center Energy Reduction by Lowering Chip-to-Supply Thermal Resistance;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
4. A High Power Density SiC Motor Drive for a 6-Phase PMSM;2023 IEEE Applied Power Electronics Conference and Exposition (APEC);2023-03-19
5. FPGA-Based Forced Air-Cooled SiC High-Power-Density Inverter for Electrical Aircraft Applications;2023 IEEE Applied Power Electronics Conference and Exposition (APEC);2023-03-19