Surface Engineering Towards Boosted Dielectric Properties for High-Temperature Polymers Under Electrical Extremes-Reference-Cited by-同舟云学术

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Surface Engineering Towards Boosted Dielectric Properties for High-Temperature Polymers Under Electrical Extremes

Published:2023-10-15 Issue: Volume: Page:1-3
ISSN:
Container-title:2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)
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Author:

Zhou Jierui¹,Dabaghian Marina²,LaChance Anna Marie²,Hao Jing³,Zhong Wesley³,Sun Luyi²,Cao Yang¹

Affiliation:

1. University of Connecticut,Department of Electrical and Computer Engineering,Storrs,CT,USA,06269

2. University of Connecticut,Department of Chemical and Biomolecular Engineering,Storrs,CT,USA,06269

3. Electrical Insulation Research Center, Institute of Materials Science, University of Connecticut,Storrs,CT,USA,06269

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10410432/10410177/10410452.pdf?arnumber=10410452

Reference8 articles.

1. Present and Future Naval Applications for Pulsed Power

2. Advanced Dielectrics for Capacitors

3. Temperature-dependent breakdown and pre-breakdown conduction of polyethylene terephthalate

4. Materials Challenges Facing Electrical Energy Storage

5. Tuning Surface States of Metal/Polymer Contacts Toward Highly Insulating Polymer-Based Dielectrics

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