Effect of Impedance Discontinuity Induced by Line Bending on Passive Intermodulation in Connector-Microstrip Assemblies-Reference-Cited by-同舟云学术

Effect of Impedance Discontinuity Induced by Line Bending on Passive Intermodulation in Connector-Microstrip Assemblies

Published:2022-09 Issue:9 Volume:32 Page:1047-1050
ISSN:1531-1309
Container-title:IEEE Microwave and Wireless Components Letters
language:
Short-container-title:IEEE Microw. Wireless Compon. Lett.

Author:

Jin Qiuyan¹^ORCID,Feng Quanyuan¹^ORCID,Flowers George T.²^ORCID,Bi Lingyu³^ORCID,Luo Junyu³

Affiliation:

1. School of Information Science and Technology, Southwest Jiaotong University, Chengdu, China

2. Department of Mechanical Engineering and the Center for Advanced Vehicle and Extreme Environment Electronics (CAVE³), Auburn University, Auburn, AL, USA

3. School of Electronic Engineering, Beijing University of Posts and Telecommunications, Beijing, China

Funder

National Natural Science Foundation of China

Sichuan Provincial Science and Technology Important Projects

Fundamental Research Funds for the Central Universities

Open Fund of Information Materials and Intelligent Sensing Laboratory of Anhui Province

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics

Link

http://xplorestaging.ieee.org/ielx7/7260/9874952/09764832.pdf?arnumber=9764832

Reference13 articles.

1. Wideband mm-wave compensated 90° bends for Grounded Coplanar Waveguide and microstrip Transmission Lines on flexible LCP substrates

2. Distributed Passive Intermodulation Distortion on Transmission Lines

3. Frequency and Power Dependence of Passive Intermodulation in Connectors With Contact-Material Nonlinear Modeling

4. Engineered Passive Nonlinearities for Broadband Passive Intermodulation Distortion Mitigation

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