Off-chip Wideband Power Divider/Combiner for Sub-THz Receiver Module-Reference-Cited by-同舟云学术

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Off-chip Wideband Power Divider/Combiner for Sub-THz Receiver Module

Published:2022-02-11 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE Delhi Section Conference (DELCON)
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Author:

Mubarak Mohamed H.¹,Hara Shinsuke¹,Dong Ruibing¹,Tanoi Satoru¹,Hagino Tatsuo¹,Watanabe Issei¹,Kasamatsu Akifumi¹

Affiliation:

1. Advanced ICT Research Institute, National Institute of Information and Communications Technology,Tokyo,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9752769/9752688/09753615.pdf?arnumber=9753615

Reference11 articles.

1. A QPSK 110-Gb/s Polarization-Diversity MIMO Wireless Link With a 220–255 GHz Tunable LO in a SiGe HBT Technology

2. 300-GHz CMOS Transceiver for Terahertz Wireless Communication

3. ULTRA-WIDEBAND FOUR-WAY IN-PHASE MULTILAYER POWER DIVIDER WITH HIGH ISOLATION

4. A 120Gb/s 16QAM CMOS millimeter-wave wireless transceiver

5. A modified Wilkinson power di-vider/combiner for ultrawideband communications;ahmed;2009 IEEE Antennas and Propagation Society International Symposium,0

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. 25.9-Gb/s 259-GHz Phased-Array CMOS Receiver Module with 28° Steering Range;2024 IEEE Radio and Wireless Symposium (RWS);2024-01-21

2. Development and Characterization of Wideband Power Divider for Sub-THz Transceiver Modules;2023 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC);2023-11-05

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