Lithography-Reference-Cited by-同舟云学术

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Lithography

Published:2021-11 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE International Roadmap for Devices and Systems Outbriefs
language:
Short-container-title:

Author:

Neisser Mark¹,Levinson Harry J.²,Wurm Stefan³,Kyser David⁴,Watanabe Takeo⁵,Macwilliams Ken⁶,Ishiuchi Hidemi,Trybula Walt⁷,Hayashi Naoya⁸,Fedynyshyn Ted⁹,Higgins Craig¹⁰,Nakamura Tsuyoshi¹¹,Resnick Doug¹²,Preil Moshe¹³,Lercel Michael¹⁴,Aoyama Hajime¹⁵,Hosler Erik¹⁶

Affiliation:

1. Xiamen University Tan Kah Kee Innovation Center

2. HJL Lithography

3. ATICE, LLC

4. Semiconductor Technology Consultant

5. University of Hyogo

6. Multibeam Corporation

7. Trybula Foundation, Inc.

8. DNP

9. MIT Lincoln Laboratory

10. KLA

11. TOK

12. Canon Nanotechnologies

13. Zeiss

14. ASML

15. Nikon

16. PsiQuantum LLC

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9827484/9827525/09827532.pdf?arnumber=9827532

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. How Lithography and Metrology Are Enabling Yield in the Next Generation of Semiconductor Patterning;Computer;2024-01

2. Scaling and readiness of underlayers for high-NA EUV lithography;International Conference on Extreme Ultraviolet Lithography 2022;2022-12-01

3. Scaling and readiness of underlayers for high-numerical aperture extreme ultraviolet lithography;Journal of Micro/Nanopatterning, Materials, and Metrology;2022-11-15

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