Analysis of Charge Trap Depth Using Q(t) Method and Quantum Chemical Calculation in XLPE and PE with Phenolic Antioxidant-Reference-Cited by-同舟云学术

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Analysis of Charge Trap Depth Using Q(t) Method and Quantum Chemical Calculation in XLPE and PE with Phenolic Antioxidant

Published:2021-12-12 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)
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Author:

Uehara H.¹,Okamoto T.¹,Sekii Y.²,Iwata S.³,Takada T.⁴

Affiliation:

1. Kanto Gakuin University,Dept. of Electrical and Electronic Engineering,Yokohama, Kanagawa,Japan,236-8501

2. Osaka Research Institute of Industrial Science and Technology,Research Division of Product Reliability,Izumi, Osaka,Japan,594-1157

3. Sekii PE Laboratory,Chiba, Chiba,Japan,275-0005

4. Tokyo City University,Dept. of Mechanical System Engineering,Setagaya, Tokyo,Japan,158-8557

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9705287/9705312/09705439.pdf?arnumber=9705439

Reference16 articles.

1. Molecular Dynamics Simulation and Quantum Chemical Calculations of Surfactant Having Suppression Effect on Water Trees

2. Deep trap sites suppressing space charge injection in polycyclic aromatic compounds doped XLPE composite

3. Interchain electron states in polyethylene

4. Space charge mechanism of polyethylene and polytetrafluoroethylene by electrode/dielectrics interface study using quantum chemical method

5. Density functional analysis of chemical impurities in dielectric polyethylene

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electronic Transitions in Biaxially Oriented Polypropylene Accounting for Photo-Stimulated Currents;2024 IEEE 5th International Conference on Dielectrics (ICD);2024-06-30

2. Impact of Antioxidants on DC and AC Electrical Properties of XLPE-Based Insulation Systems;IEEE Access;2023

3. Electric Field and Temperature Characteristics of Accumulated Charge Amount in Several Polymeric Insulating Materials Using Q(t) Method and Quantum Chemical Calculation;2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP);2022-10-30

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