Simulation Analysis of The Optimal Process Parameters of Surface Mount Capacitor
Author:
Affiliation:
1. The 36TH Research Institute of China Electronics Technology Group Corporation,Jiaxing,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9941505/9941739/09941836.pdf?arnumber=9941836
Reference8 articles.
1. StepwiseS-Ncurve and fish-eye failure in gigacycle fatigue
2. 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Comparison of Darveaux model and Coffin-Manson model [J];jiang;IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin China (2017 8 16-2017 8 19),0
3. A critical plane fatigue model applied to out-of-phase bending and torsion load conditions
4. Thermal fatigue reliability for Cu-Pillar bump interconnection in flip chip on module and underfill effects
5. Experimental Verification of the Analytical Method for Estimated S-N Curve in Limited Fatigue Life
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