Carbon nanotubes in nanopackaging applications
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Mechanical Engineering
Link
http://xplorestaging.ieee.org/ielx5/4451717/5227804/05227814.pdf?arnumber=5227814
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Electro-Thermal Response of Industrial-Grade Graphene for Electronic Packages Applications;2024 IEEE 28th Workshop on Signal and Power Integrity (SPI);2024-05-12
2. Mini-Review: Modeling and Performance Analysis of Nanocarbon Interconnects;Applied Sciences;2019-05-28
3. Electrical Permittivity and Conductivity of a Graphene Nanoplatelet Contact in the Microwave Range;Materials;2018-12-11
4. Electrothermal Characterization of the Electrical Resistance of Graphene Contacts for Packages;2018 IEEE 18th International Conference on Nanotechnology (IEEE-NANO);2018-07
5. Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits;Applied Sciences;2018-03-21
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