Advances in liquid coolant technologies for electronics cooling-Reference-Cited by-同舟云学术

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Advances in liquid coolant technologies for electronics cooling

Published: Issue: Volume: Page:
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Container-title:Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.
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Author:

Mohapatra S.C.,Loikits D.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/9693/30598/01412204.pdf?arnumber=1412204

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Integration of a High Power Polyphase Inductive Coil Assembly;2024 IEEE Transportation Electrification Conference and Expo (ITEC);2024-06-19

2. Effect of L-Cysteine on Micro-Galvanic Corrosion of ADC12 Aluminum Alloy in a Low-Conductivity Coolant for Electric Vehicles;Journal of The Electrochemical Society;2024-03-18

3. Numerical study on channel-flow convection heat transfer enhancement with piezoelectric fans under various operating conditions;Applied Thermal Engineering;2023-01

4. Corrosion Inhibition Effect of L-Cysteine on Micro-Galvanic Corrosion of Adc12 Aluminum Alloy in a Simulated Low-Conductivity Coolant for Electric Vehicles;2023

5. Thermal-Hydraulic Characterisation of Electronics Cooling Liquids: A Case Study of Jet Impingement Coldplate on Emulated CPU;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28

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