Author:
Kong Yungcheol,Chae Jonghan,Kim Minkyoon,Lee Young,Cho Kangyong
Cited by
2 articles.
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1. A multimodal fusion method for soldering quality online inspection;Journal of Intelligent Manufacturing;2024-05-14
2. Improving flip chip process for large 2.5D molded interposer;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06