Evaluation of the influence of the reliability application of a thermal insulation adhesive on the reliability of solder joints
Author:
Affiliation:
1. Xi'an Research Institute of Navigation Technology,Xi'an,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492392.pdf?arnumber=10492392
Reference5 articles.
1. Study on the Process of BGA Device Bottom Filled with Thermal Conductive Insulating Adhesive
2. Microstructure, joint strength and failure mechanisms of SnPb and Pb-free solders in BGA packages
3. Effect of Electromigration on Interfacial Reaction In Ni/Sn63Pb37/Cu BGA Solder Joints
4. Investigation of Thermomechanical Behaviors of Flip Chip BGA Packages During Manufacturing Process and Thermal Cycling
5. Drop performance evaluation for application of different underfill processes
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