Fabrication of 45-Degree Integrated Mirrors for Three-Dimensional Board-Level Optical Interconnects Realizing Efficient Light Coupling
Author:
Affiliation:
1. Shennan Circuits Co., Ltd.,R&D Department,Shenzhen,China
2. Sky Chip Interconnection Technology Co., Ltd.,R&D Department,Shenzhen,China
3. Chinese Academy of Sciences,Shenzhen Institute of Advanced Technology,Shenzhen,China
Funder
Research and Development
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492032.pdf?arnumber=10492032
Reference21 articles.
1. Ultra-Low Cost High-Density Two-Dimensional Visible-Light Optical Interconnects
2. Error-free Three-Dimensional Multimode Crossover Graded-Index Polymer Waveguides for Board-Level Optical Circuitry
3. Facile fabrication and optical properties of polymer waveguides with smooth surface for board-level optical interconnects
4. Fabrication and characterization of polymer optical waveguides with integrated micromirrors for three-dimensional board-level optical interconnects
5. Survey of Photonic and Plasmonic Interconnect Technologies for Intra-Datacenter and High-Performance Computing Communications
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