A failure analysis of solder flow in DC-DC power module-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

A failure analysis of solder flow in DC-DC power module

Published:2023-08-08 Issue: Volume: Page:1-4
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
language:
Short-container-title:

Author:

Shaoling Jiao¹,Wei Liu¹,Tao Wen¹,Jia Zhu¹

Affiliation:

1. Electric Power Dispatching Control Center Guangdong Power Grid Co., Ltd,Guangzhou,China

Funder

China Southern Power Grid

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10491959.pdf?arnumber=10491959

Reference6 articles.

1. Investigation on failures of plastic package devices with unidentifiable defects related to deficient molding process

2. Experimental Evaluation of a Low-Cost QFN Silicon Carbide Half-Bridge Module

3. Thermal analysis of DC/DC power module based on innovative model with the application of active area loading

4. Failure analysis of long-distance power supply for a DC-DC converter micro-module

5. Damage protection of power modules;Hohlfeld

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP