Optimizing conformal shielding scheme with quantitative analysis-Reference-Cited by-同舟云学术

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Optimizing conformal shielding scheme with quantitative analysis

Published:2023-08-08 Issue: Volume: Page:1-6
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Xinyu Zhang¹,Jun Li¹,Chenglin Yang¹,Jian Yuan²,Huilin An¹,Wenwen Zhang¹,Minghao Zhou³

Affiliation:

1. Institute of Microelectronic of Chinese Academy of Sciences,Microsystem Packaging Research Center,Beijing,China

2. University of Science and Technology of China,Department of Microelectronic,Beijing,China

3. Nanjing University,School of Electronic Science and Engineering,Nanjing,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492350.pdf?arnumber=10492350

Reference9 articles.

1. Cramming More Components Onto Integrated Circuits

2. Fifty Years of Moore's Law

3. EMI shielding performance by metal plating on mold compound

4. Research on conformal EMI shielding Cu/Ni layers on package

5. Novel EMI shielding methodology on highly integration SiP module

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