Fabrication of Full Glass Antenna-in-Package by Laser Transmission Welding
Author:
Affiliation:
1. China Electronics Technology Group Corporation,The 38th Research Institute Key Lab of Aperture Array and Space Application (KLAASA),Hefei,China
2. China Electronics Technology Group Corporation,The 38th Research Institute,Hefei,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492330.pdf?arnumber=10492330
Reference12 articles.
1. Technology Analysis of Information Exchange Based on Integrated Wireless Sensing and Communication;Chengkang;Radio Communications Technogy,2021
2. Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs
3. Fabrication, assembly and testing of a glass interposer-based 3D systems in package
4. Development of low cost through glass via (TGV) interposer with high-Q inductor and MIM capacitor
5. The development of low cost Through Glass Via (TGV) interposer using additive method for via filling
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