Impact of Zn Content on Cu/Al Joints with (Cu+Zn+Al) Mixed Particles-Reference-Cited by-同舟云学术

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Impact of Zn Content on Cu/Al Joints with (Cu+Zn+Al) Mixed Particles

Published:2023-08-08 Issue: Volume: Page:1-4
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Zhou Jin¹,Gan Guisheng¹,Luo Jie¹,Chen Siwen¹,Yang Hao¹,Ma Yongchong¹,Wang Huaishan²,Xia Daquan³,Wang Weisheng⁴

Affiliation:

1. Chongqing University of Technology,College of Materials Science and Engineering,Chongqing,China

2. United Microelectronics Center Co.,Ltd,Chongqing,China

3. Chongqing Pingwei Enterprise Co.,Ltd,Chongqing,China

4. Chongqing Pingwei Technology (Group) Co., Ltd,Chongqing,China,400026

Funder

National Natural Science Foundation of China

China Postdoctoral Science Foundation

Chongqing Municipal Education Commission

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492219.pdf?arnumber=10492219

Reference6 articles.

1. Interfacial microstructure and reaction mechanism with various weld fillers on laser welding-brazing of Al/Cu lap joint

2. Interfacial structure and properties of Cu/Al joints brazed with Zn-Al filler metals

3. Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn–3Al filler metal

4. Ultrasonically enhanced flux-less bonding with Zn-5Al alloy under ambient condition for high-temperature electronics interconnects

5. Characterizing the Soldering Alloy Type Zn–Al–Cu and Study of Ultrasonic Soldering of Al7075/Cu Combination

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