Integrated Data Acquisition Module based on CPO packaging-Reference-Cited by-同舟云学术

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Integrated Data Acquisition Module based on CPO packaging

Published:2023-08-08 Issue: Volume: Page:1-3
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Lv Xiaomeng¹,Xibin Li¹,Shaoyong Chen¹,Xu Weihua¹,Yangzhi Liu²,Wu Yilong²,Yunke Zhu¹,Tao Zhou¹

Affiliation:

1. Sichuan Provincial Key Laboratory of Science and Technology on Microwave Photonics,The 29th Research Institute of China Electronics Technology Group Corporation,Chengdu,China

2. The 29th Research Institute of China Electronics Technology Group Corporation,Chengdu,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492313.pdf?arnumber=10492313

Reference5 articles.

1. Digital Subcarrier Multiplexing: Enabling Software-Configurable Optical Networks

2. Subkilohertz linewidth reduction of a DFB diode laser using self-injection locking with a fiber Bragg grating Fabry-Perot cavity

3. Frequency tunable optoelectronic oscillator based on a directly modulated DFB semiconductor laser under optical injection

4. VCSEL-Based Interconnects for Current and Future Data Centers

5. External vs. Integrated Light Sources for Intra-Data Center Co-Packaged Optical Interfaces

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