Design and characterization of novel doped heterostructured electromagnetic shielding packaging materials for Current sensor chip applications-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Design and characterization of novel doped heterostructured electromagnetic shielding packaging materials for Current sensor chip applications

Published:2023-08-08 Issue: Volume: Page:1-5
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
language:
Short-container-title:

Author:

Huang Haichao¹,Wang Shuaipeng²,Chen Yanning²,Fu Zhen²,Li Yongfu³,Jiang Xiping³

Affiliation:

1. Beijing Smart-Chip Microelectronics Technology Co., Ltd.,State Grid Key Laboratory of Power Industrial Chip Design and Analysis Technology,Beijing,China

2. Beijing Smart-Chip Microelectronics Technology Co., Ltd.,Beijing,China

3. State Grid Chongqing Electric Power Company Electric Power Research Institute.,Chongqing,China

Funder

State Grid Corporation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492031.pdf?arnumber=10492031

Reference9 articles.

1. Highly conductive polystyrene/carbon nanotube/PEDOT:PSS nanocomposite with segregated structure for electromagnetic interference shielding

2. Carbon spheres@MnO2 core-shell nanocomposites with enhanced dielectric properties for electromagnetic shielding

3. Facile preparation of asymmetric Ni/PVC film with controlled structure: Application as a high-performance EMI shielding material

4. Structure Design and Processing Strategies of MXene‐Based Materials for Electromagnetic Interference Shielding

5. Composites based on layered materials for absorption of microwaves and electromagnetic shielding

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP