Orientation-related stress analysis of nanotwinned copper in redistributed layer for wafer-level packaging-Reference-Cited by-同舟云学术

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Orientation-related stress analysis of nanotwinned copper in redistributed layer for wafer-level packaging

Published:2023-08-08 Issue: Volume: Page:1-5
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Wang Zesong¹,Zhong Cheng²,Li Peifeng¹,Liu Zhi-Quan¹

Affiliation:

1. Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology,CAS,Shenzhen,China,518055

2. Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology,Chinese Academy of Sciences,Shenzhen,China,518055

Funder

National Natural Science Foundation of China

Chinese Academy of Sciences

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492100.pdf?arnumber=10492100

Reference11 articles.

1. Ultrahigh Strength and High Electrical Conductivity in Copper

2. High-strength sputter-deposited Cu foils with preferred orientation of nanoscale growth twins

3. High-toughness (111) nano-twinned copper lines for fan-out wafer-level packaging

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