Thermal stress analysis and optimization of BGA stacked solder joints under power cyclic loading-Reference-Cited by-同舟云学术

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Thermal stress analysis and optimization of BGA stacked solder joints under power cyclic loading

Published:2023-08-08 Issue: Volume:6 Page:1-5
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Liu Xianjia¹,Huang Chunyue¹,Wang Lilin¹,Wu Liye¹,Liu Xiaobin¹,Zhang Huaiquan¹

Affiliation:

1. Guilin University of Electronic Technology,School of Electronic Mechanical Engineering,Guilin,China

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492307.pdf?arnumber=10492307

Reference10 articles.

1. Research on the development trend of microelectronic packaging technology [J];Tai;Modern Information Technology,2018

2. Application of finite element numerical simulation in the reliability study of BGA/QFP/CCGA devices with solder joints[J];Zhuojie;Electronics and Packaging,2020

3. Real-time holographic interferometric measurement of thermal deformation of surface mounted device (SM D) in power cycle [J];Weining;Journal of Semiconductors,1998

4. Life prediction and analysis of solder joints in CSP package under pow er recycling [J];Qiang;Journal of Zhejiang University of Technology,2006

5. Analysis and optimization of BGA solder joint power load thermal stress based on regression analysis and genetic algorithm[J];Jianpei;Journal of Electronics,2019

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