Design of Optoelectronic Chip Packaging and Integration Method Based on SiP Technology
Author:
Affiliation:
1. Tongfu Microelectronics Co. Ltd.,Nantong,China
2. Fudan University,School of Microelectronics,Shanghai,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492243.pdf?arnumber=10492243
Reference25 articles.
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2. The Influence of Epoxy Molding Compound Poissons Ratio on the Reliability of Ball Grid Array Packaging[J];Chenglong;Journal of Integration Technology,2021
3. Design, integration and implementation of crypto cores in an SoC environment
4. Thermal Cycling Test and Simulation of Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous Integration
5. Sensitivity Analysis for Geometrical Parameters of BGA in Flip-Chip Packaging Under Random Shear Stress and Thermal Temperature
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