Injection molding process optimization of plastic packaging device based on GA and BP neural network
Author:
Affiliation:
1. Guilin University Of Electronic Technology,School of Mechanical and Electrical Engineering,Guilin,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492007.pdf?arnumber=10492007
Reference13 articles.
1. Research on highly reliable plastic packaging technology[J];Chu;Electronic Product Reliability and Environmental Testing,2021
2. SOP8 layering exploration and solution[J];Li;Electronics and Packaging,2019
3. Optimization of process parameters for injection molding quality and energy consumption based on GA-BP neural network[J];Xiaodong;Engineering Plastics Applications,2023
4. In-mold and Machine Sensing and Feature Extraction for Optimized IC-tray Manufacturing
5. Optimization of processing parameters for minimizing warpage of large thin-walled parts in whole stages of injection molding
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