1. Southern University of Science and Technology,School of Microelectronics,Shenzhen,China
2. Research Institute of Fudan University in Ningbo,Ningbo,China
3. ShenZhen PhasedCom Communication Technology Co., Ltd.,Shenzhen,China
4. Southern University of Science and Technology,Joint Lab for Advanced Semiconductor Packaging Technologies; Joint Lab for Advanced Packaging and Testing Technology of Integrated Circuits; School of Microelectronics,Shenzhen,China