Thermal Management Method of Three-dimensional Integrated Inductors Based on Dielectric-cavity TSV Technology

Author:

Zhou Wangjun1,Qu Chenbing1,Fu Zhiwei2,Chen Si2,Wang Liwei2,Sun Chen2

Affiliation:

1. China Electronic Product Reliability and Environmental Testing Research Institute,Science and Technology on Reliability Physics and Application of Electronic Component Laboratory,China,511370

2. China Electronic Product Reliability and Environmental Testing Research Institute,Science and Technology on Reliability Physics and Application of Electronic Component Laboratory,Guangzhou,China

Funder

National Natural Science Foundation of China

Publisher

IEEE

Reference8 articles.

1. Thermal-ADI - a linear-time chip-level dynamic thermal-simulation algorithm based on alternating-direction-implicit (ADI) method;Wang;IEEE Transactions on Very Large Scale Integration Systems

2. A novel thermal-aware structure of TSV cluster

3. Effect of TSV interposer on the thermal performance of FCBGA package

4. Finite element analysis of thermal stress in Through-Silicon Via structure

5. Wideband Substrate Integrated Waveguide Bandpass Filter Based on 3-D ICs

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