Thermal-mechanical Reliability and Package Optimization of a dToF Photon Imaging sensor
Author:
Affiliation:
1. Guilin University of Electronic Technology,School of Mechanical and Electrical Engineering,Guilin,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492384.pdf?arnumber=10492384
Reference6 articles.
1. An all-in-one 64-zone SPAD-based Direct-Time-of-Flight Ranging Sensor with Embedded Illumination
2. Effect of Moisture in a Non-conductive Glue on the Electrical Performance of a Cavity Package
3. Validation and Optimization of Calculated Stress Fields in Double-Mold Optoelectronics Sensor Packaging
4. Simulation of moisture-induced plasticization in transfer-molded optical sensor packages using a time - temperature - moisture concentration superposition
5. Characterization and simulation of delamination on package-level considering sub-critical interfacial fracture-parameters under cyclic loading.
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