TGV filling process based on low temperature conductive silver paste-Reference-Cited by-同舟云学术

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TGV filling process based on low temperature conductive silver paste

Published:2023-08-08 Issue: Volume: Page:1-4
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Yu Chen¹,Li Wei¹,Yang Tingting²,Wu Heng²,Yu Daquan³

Affiliation:

1. Xiamen University,Department of Microelectronics and Integrated Circuit,Xiamen,China

2. Xiamen Sky Semiconductor Technology,Product Development Department,Xiamen,China

3. Xiamen University,Xiamen Sky Semiconductor Technology Co.Ltd.,Department of Microelectronics and Integrated Circuit,Xiamen,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492174.pdf?arnumber=10492174

Reference1 articles.

1. The development of low cost Through Glass Via (TGV) interposer using additive method for via filling

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