Silver@Expanded Microspheres/Silicone Conductive Composites with Ultra-low Compression Stress for Electromagnetic Interference Shielding in Electronic Packaging-Reference-Cited by-同舟云学术

Silver@Expanded Microspheres/Silicone Conductive Composites with Ultra-low Compression Stress for Electromagnetic Interference Shielding in Electronic Packaging

Published:2023-08-08 Issue: Volume: Page:1-4
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Duan Yingjie¹,Zhang Luhui²,Wang Yong³,Xu Yadong³,Sun Rong³,Hu Yougen³

Affiliation:

1. University of Science and Technology of China,Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences. School of Nano Science and Technology,Suzhou,China,215000

2. Shenzhen University,Shenzhen Institute of Advanced Electronic Materials, ShenzhenInstitute of Advanced Technology, Chinese Academy of Sciences College of Materials Science and Engineering,Shenzhen,China,518055

3. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology,Shenzhen,China,518055

Funder

National Natural Science Foundation of China

China Postdoctoral Science Foundation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492388.pdf?arnumber=10492388

Reference16 articles.

1. Biological effects of electromagnetic fields

2. Intelligent shielding material based on VO2 with tunable near-field and far-field electromagnetic response

3. Influence of multi-walled carbon nanotube (MWCNT) concentration on the thermo-mechanical reliability properties of solderable anisotropic conductive adhesives (SACAs)

4. Polymer Nanocomposites Containing Semiconductors as Advanced Materials for EMI Shielding

5. Effect of Processing Techniques on EMI SE of Immiscible PS/PMMA Blends Containing MWCNT: Enhanced Intertube and Interphase Scattering