The correlation between the microstructure and mechanical property of low temperature sintering nano Ag paste-Reference-Cited by-同舟云学术

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The correlation between the microstructure and mechanical property of low temperature sintering nano Ag paste

Published:2023-08-08 Issue: Volume: Page:1-5
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Zhou Qihang¹,Yang Fan²,Dong Bolong¹,Du Jianjun²,Li Mingyu¹

Affiliation:

1. Harbin Institute of Technology (Shenzhen),Sauvage Laboratory for Smart Materials, School of Mterials Science and Engineering,Shenzhen,China

2. Harbin Institute of Technology (Shenzhen),School of Mechanical Engineering and Automation,Shenzhen,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492173.pdf?arnumber=10492173

Reference14 articles.

1. Future Energy Systems: Integrating Renewable Energy Sources into the Smart Power Grid Through Industrial Electronics

2. Wide Bandgap Technologies and Their Implications on Miniaturizing Power Electronic Systems

3. Commercial GaN-Based Power Electronic Systems: A Review

4. Wide bandgap semiconductor opportunities in power electronics

5. Creep deformation characteristics of tin and tin-based electronic solder alloys

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