Development of high reflectance insulating film materials for packaging semiconductor optical devices-Reference-Cited by-同舟云学术

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Development of high reflectance insulating film materials for packaging semiconductor optical devices

Published:2023-08-08 Issue: Volume: Page:1-4
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Chen Wei-Su¹,Wang Yun²,Huang Shiqiao³,Li Zheng⁴,He Dandan³,Zhang Jianwei²,Twan Evan²,Liu Xin⁴,Chen Ziming⁵

Affiliation:

1. Research Center Quantechmaterials (Guangzhou) Co., LTD,Guangzhou,China

2. Quantechmaterials (Guangzhou) Co., LTD,Material Research Department,Guangzhou,China

3. Quantechmaterials (Guangzhou) Co., LTD,Quality Control(QC) Department,Guangzhou,China

4. Quantechmaterials (Guangzhou) Co., LTD,Process Development Department,Guangzhou,China

5. Quantechmaterials (Guangzhou) Co., LTD,Lithography Research Department,Guangzhou,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492156.pdf?arnumber=10492156

Reference4 articles.

1. Strategically constructed high-reflectivity multiple-stack distributed Bragg reflectors for efficient GaN-based flip-chip mini-LEDs

2. Enhanced performance of GaN-based visible flip-chip mini-LEDs with highly reflective full-angle distributed Bragg reflectors

3. Design and fabrication of bi-functional TiO2/Al2O3 nanolaminates with selected light extraction and reliable moisture vapor barrier performance

4. Reduction of water in inorganic spin on glass

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