Reliability Analysis and Evaluation of Epoxy Resin Adhesive for LED Encapsulation-Reference-Cited by-同舟云学术

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Reliability Analysis and Evaluation of Epoxy Resin Adhesive for LED Encapsulation

Published:2023-08-08 Issue: Volume:24 Page:1-4
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Xu Huanxiang¹,Gu Jiabao¹,Zu Gang¹,Tang Yanhuang¹,Chen Chengcheng¹,Liu Zilian¹

Affiliation:

1. The Fifth Electronics Research Institute of Ministry of Industry and Information Technology,Guangzhou,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10491964.pdf?arnumber=10491964

Reference10 articles.

1. A revolution in lighting

2. Current situation and Development Trend of LED Packaging;Xue-bing;New Material and New Technology,2018

3. Heat and fluid flow in high-power LED packaging and applications

4. Cationic polymerization of hydrogenated bisphenol-A glycidyl ether with cycloaliphatic epoxy resin and its thermal discoloration

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