HMM-Based Joint Modeling of Condition Monitoring Signals and Failure Event Data for Prognosis
Author:
Affiliation:
1. Department of Industrial and Systems Engineering, University of Wisconsin-Madison, Madison, WI, USA
2. Department of Industrial and Systems Engineering, University of Iowa, Iowa City, IA, USA
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality
Link
http://xplorestaging.ieee.org/ielx7/24/4378406/09851559.pdf?arnumber=9851559
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