A high-density, four-channel, OEIC transceiver module utilizing planar-processed optical waveguides and flip-chip, solder-bump technology-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

A high-density, four-channel, OEIC transceiver module utilizing planar-processed optical waveguides and flip-chip, solder-bump technology

Published:1994-07 Issue:7 Volume:12 Page:1185-1191
ISSN:0733-8724
Container-title:Journal of Lightwave Technology
language:
Short-container-title:J. Lightwave Technol.

Author:

Jackson K.P.,Flint E.B.,Cina M.F.,Lacey D.,Kwark Y.,Trewhella J.M.,Caulfield T.,Buchmann P.,Harder Ch.,Vettiger P.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx1/50/7452/00301811.pdf?arnumber=301811

Cited by 26 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Novel Solder Pads for Self-Aligned Flip-Chip Assembly;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05

2. Pluggable photonic circuit platform for single-mode waveguide connections using novel passive alignment method;Japanese Journal of Applied Physics;2018-07-06

3. Solder Mobility for High-Yield Self-Aligned Flip-Chip Assembly;2017 IEEE 67th Electronic Components and Technology Conference (ECTC);2017-05

4. A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities;IEEE Journal of Selected Topics in Quantum Electronics;2016-11

5. Toward High-Yield 3D Self-Alignment of Flip-Chip Assemblies via Solder Surface Tension;2016 IEEE 66th Electronic Components and Technology Conference (ECTC);2016-05

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP