On a Moreau Envelope Wirelength Model for Analytical Global Placement
Author:
Affiliation:
1. Peking University,Beijing,China
2. The Chinese University of Hong Kong,Hong Kong,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10247654/10247655/10247712.pdf?arnumber=10247712
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1. Analytical placement
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4. DREAMPlace 3.0
5. Non-linear optimization system and method for wire length and delay optimization for an automatic electric circuit placer;naylor;US Patent,2001
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