Mounting of high power laser diodes on diamond heatsinks
Author:
Affiliation:
1. Centre of Microperipheric Technols., Tech. Univ. Berlin, Germany
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering
Link
http://xplorestaging.ieee.org/ielx4/95/10404/00486562.pdf?arnumber=486562
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2. Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver–indium multilayer structure;Journal of Materials Science: Materials in Electronics;2020-04-22
3. Samples and Characterization;Quantum-Dot-Based Semiconductor Optical Amplifiers for O-Band Optical Communication;2016-10-22
4. Development Trend and Challenges in High Power Semiconductor Laser Packaging;Packaging of High Power Semiconductor Lasers;2014-04-12
5. Low Temperature Gold-to-Gold Bonded Semiconductor Disk Laser;IEEE Photonics Technology Letters;2013-06
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