Integration, cooling and packaging issues for aerospace equipments-Reference-Cited by-同舟云学术

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Integration, cooling and packaging issues for aerospace equipments

Published:2010-03 Issue: Volume: Page:
ISSN:
Container-title:2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010)
language:
Short-container-title:

Author:

Sarno C,Tantolin C

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5450668/5456897/05456994.pdf?arnumber=5456994

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Co-simulations of Thermal Properties;Co-simulations of Microwave Circuits and High-Frequency Electromagnetic Fields;2024

2. Design and experimental validation of a high capacity loop heat pipe for avionics cooling;Thermal Science and Engineering Progress;2023-10

3. Experimental study of thermal performance in a closed loop pulsating heat pipe with alternating superhydrophobic channels;Thermal Science and Engineering Progress;2020-06

4. Thermal performance of a novel flat thermosyphon for avionics thermal management;Energy Conversion and Management;2019-12

5. Passive aircraft cooling systems for variable thermal conditions;Applied Thermal Engineering;2015-03

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