Inspection Methodology for Improving Wafer Quality in Semiconductor Production-Reference-Cited by-同舟云学术

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Inspection Methodology for Improving Wafer Quality in Semiconductor Production

Published:2024-01-31 Issue: Volume:47 Page:249-252
ISSN:
Container-title:2024 Joint International Conference on Digital Arts, Media and Technology with ECTI Northern Section Conference on Electrical, Electronics, Computer and Telecommunications Engineering (ECTI DAMT & NCON)
language:
Short-container-title:

Author:

Kwon So-Young¹,Kim Young-Hyung²,Lee Yong-Hwan³,Park Jong-Ik⁴,Lee Chang-Yong¹

Affiliation:

1. Kumoh National Institute of Technology,Department of Electronic Engineering,Gumi,Korea

2. Kumoh National Institute of Technology,Defartment of IT Convergence,Gumi,Korea

3. Kumoh National Institute of Technology,School of Electronic Engineering,Gumi,Korea

4. Sejung Robot,Gumi,Korea

Funder

Ministry of SMEs and Startups

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10479959/10479962/10480090.pdf?arnumber=10480090

Reference14 articles.

1. Development of an Accuracy-improved Vision Inspection System for BGA Solder Ball;Huh;System and Control,2010

2. Visual Inspection Method Which Improves Accuracy By using Histogram Transformation;Han;System and Control,2019

3. Car Engine Sealing Inspection System Based on Analysis of Difference Image

4. Semiconductor wafer capacity expansion… Pour 10 trillion won;Kwon;etnews,2023

5. Machine Vision-based Defect Detection Using Deep Learning Algorithm

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