Damage Separation in Proton-Irradiated Bipolar Junction Transistors as a Function of Energy
Author:
Affiliation:
1. Northrop Grumman Corporation, Linthicum Heights, Virginia, MD, USA
2. Department of Electrical and Computer Engineering, Vanderbilt University, Nashville, TN, USA
Funder
Northrop Grumman Remote Sensing Programs Initiative
Internal Technical Activity Program
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Nuclear Energy and Engineering,Nuclear and High Energy Physics
Link
http://xplorestaging.ieee.org/ielx7/23/10221199/10065393.pdf?arnumber=10065393
Reference37 articles.
1. Improved Model for Increased Surface Recombination Current in Irradiated Bipolar Junction Transistors
2. Total Ionizing Dose Effects in MOS and Low-Dose-Rate-Sensitive Linear-Bipolar Devices
3. Damage correlations in semiconductors exposed to gamma, electron and proton radiations
4. X-Ray Wafer Probe for Total Dose Testing
5. Review of displacement damage effects in silicon devices
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