Zero level metal thin film package for RF MEMS-Reference-Cited by-同舟云学术

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Zero level metal thin film package for RF MEMS

Published:2010-01 Issue: Volume: Page:
ISSN:
Container-title:2010 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)
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Author:

Barriere F.,Crunteanu A.,Bessaudou A.,Pothier A.,Cosset F.,Mardivirin D.,Blondy P.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5418377/5422794/05422957.pdf?arnumber=5422957

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Monolithic Integration of a Wafer-Level Thin-Film Encapsulated mm-Wave RF-MEMS Switch in BEOL of a 130-nm SiGe BiCMOS Technology;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-06

2. A comprehensive overview of recent developments in RF-MEMS technology-based high-performance passive components for applications in the 5G and future telecommunications scenarios;Facta universitatis - series: Electronics and Energetics;2021

3. Development and Modeling of a Wafer-Level BCB Packaging Method for Capacitive RF MEMS Switches;Journal of Microelectromechanical Systems;2019-08

4. Wafer-Level Vacuum-Packaged Flexible and Bendable Micro Accelerometer;IEEE Sensors Journal;2018-05-15

5. Electromagnetic and small-signal modeling of an encapsulated RF-MEMS switch for D-band applications;International Journal of Microwave and Wireless Technologies;2017-02-13

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