Author:
Meng Wuji,Zhang Fanghua,Fu Zirui
Cited by
11 articles.
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1. High Power-Density Design Based on WBG GaN Devices for Three-Phase Motor Drives;2024 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM);2024-06-19
2. PCB Layout Evaluation of GaN HEMT Power Loop;2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS);2023-11-10
3. Overview of GaN HEMT technology for high frequency applications;2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia);2023-05-22
4. Design Investigation of Liquid Cooled Heat Sink for GaN FET Dual-Three Phase Inverter;2022 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM);2022-06-22
5. A Thorough Review of Cooling Concepts and Thermal Management Techniques for Automotive WBG Inverters: Topology, Technology and Integration Level;Energies;2021-08-13