A closed form expression for TSV-based on-chip spiral inductor-Reference-Cited by-同舟云学术

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A closed form expression for TSV-based on-chip spiral inductor

Published:2012-05 Issue: Volume: Page:
ISSN:
Container-title:2012 IEEE International Symposium on Circuits and Systems
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Author:

Salah Khaled,El Rouby Alaa,Ragai Hani,Ismail Yehea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6257548/6270389/06271760.pdf?arnumber=6271760

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design of a Low-pass Filter Based on the Through-Silicon-Via Structure;2023 International Conference on Microwave and Millimeter Wave Technology (ICMMT);2023-05-14

2. A fast analytical model for TSV-based toroidal inductors;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

3. Compact high-performance dual-frequency power divider based on TSV;Microelectronics Journal;2022-11

4. Electrical models of through silicon Vias and silicon‐based devices for millimeter‐wave application;International Journal of RF and Microwave Computer-Aided Engineering;2018-08-04

5. Novel Through-Silicon-Via Inductor-Based On-Chip DC-DC Converter Designs in 3D ICs;ACM Journal on Emerging Technologies in Computing Systems;2014-11-18

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