Assembly and solder joint reliability of plastic ball grid array with lead-free versus lead-tin interconnect-Reference-Cited by-同舟云学术

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Assembly and solder joint reliability of plastic ball grid array with lead-free versus lead-tin interconnect

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Container-title:2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)
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Author:

Levis K.-M.,Mawer A.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6887/18541/00853326.pdf?arnumber=853326

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. A Wire Bondless SiC Switching Cell With a Vertically Integrated Gate Driver;IEEE Transactions on Power Electronics;2020-09

3. Assessed interfacial strength and elastic moduli of the bonding material from shear-off test data;Journal of Materials Science: Materials in Electronics;2017-02-08

4. Board level reliability analysis of chip resistor assemblies under thermal cycling: A comparison study between SnPb and SnAgCu;Journal of Mechanical Science and Technology;2014-03

5. Hybrid Experimental-Computational Approach for Solder/IMC Interface Shear Strength Determination in Solder Joints;IEEE Transactions on Components and Packaging Technologies;2010-09

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