Highly-reliable, 30µm pitch copper interconnects using nano-ACF/NCF-Reference-Cited by-同舟云学术

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Highly-reliable, 30µm pitch copper interconnects using nano-ACF/NCF

Published:2009-05 Issue: Volume: Page:
ISSN:
Container-title:2009 59th Electronic Components and Technology Conference
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Author:

Kumbhat Nitesh,Choudhury Abhishek,Raine Melanie,Mehrotra Gaurav,Raj P. Markondeya,Zhang Rongwei,Moon Kyoung S.,Chatterjee Ritwik,Sundaram Venky,Meyer-Berg Georg,Wong C. P.,Tummala Rao R.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5066986/5073977/05074208.pdf?arnumber=5074208

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Modelling Technologies and Applications;Nanopackaging;2018

2. Low-Temperature Cu–Cu Direct Bonding Using Pillar–Concave Structure in Advanced 3-D Heterogeneous Integration;IEEE Transactions on Components, Packaging and Manufacturing Technology;2017-09

3. Co-W nanocrystalline electrodeposits as barrier for interconnects;Journal of Solid State Electrochemistry;2014-05-11

4. Multichip Embedding Technology Using Fine-Pitch Cu–Cu Interconnections;IEEE Transactions on Components, Packaging and Manufacturing Technology;2013-02

5. Testing of Copper Pillar Bumps for Wafer Sort;IEEE Transactions on Components, Packaging and Manufacturing Technology;2012-06

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