Analysis of the Induced Stresses in Silicon During Thermcompression Cu-Cu Bonding of Cu-Through-Vias in 3D-SIC Architecture-Reference-Cited by-同舟云学术

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Analysis of the Induced Stresses in Silicon During Thermcompression Cu-Cu Bonding of Cu-Through-Vias in 3D-SIC Architecture

Published:2007 Issue: Volume: Page:
ISSN:
Container-title:2007 Proceedings 57th Electronic Components and Technology Conference
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Author:

Okoro Chukwudi,Gonzalez Mario,Vandevelde Bart,Swinnen Bart,Eneman Geert,Stoukatch Serguei,Beyne Eric,Vandepitte Dirk

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4249837/4249838/04249891.pdf?arnumber=4249891

Cited by 32 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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4. Heterogeneous 3-D Integration of Multitier Compute-in-Memory Accelerators: An Electrical-Thermal Co-Design;IEEE Transactions on Electron Devices;2021-11

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