Shear deformation of lead free solder joints
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/9844/31024/01441377.pdf?arnumber=1441377
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Investigating the Evolution of Creep Properties During Thermal Cycling of Homogeneous Lead-Free Solder Joints;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-12
2. The Effects of Thermal Exposure on the Creep Behavior of SAC+Bi Lead-Free Solders;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
3. Evolution of the Creep Response of SAC+Bi Lead-Free Solders Subjected to Various Thermal Exposures;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
4. High Strain Rate Mechanical Properties of M758 Solder at Extreme Surrounding Temperatures, with 100°C Isothermal Aging for up to 180 Days;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
5. Effect of Prolonged Storage on High strain rate Mechanical properties of QSAC10 and QSAC20 Solders after Exposure to Isothermal Aging of 50°C;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
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