Controlling Cu electroplating to prevent sporadic voiding in Cu<inf>3</inf>Sn-Reference-Cited by-同舟云学术

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Controlling Cu electroplating to prevent sporadic voiding in Cu3Sn

Published:2009-05 Issue: Volume: Page:
ISSN:
Container-title:2009 59th Electronic Components and Technology Conference
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Author:

Yin Liang,Kondos Pericles,Borgesen Peter,Liu Yihua,Bliznakov Stoyan,Wafula Fred,Dimitrov Nikolay,Henderson Donald W.,Parks Christopher,Gao Mao,Therriault Joseph,Wang Ju,Cotts Eric

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5066986/5073977/05074046.pdf?arnumber=5074046

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Solder Reaction with Cu Alloy C7025 and Its Effect on Solder Joint Reliability;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Alteration of Cu3Sn growth and retention of multi-orientation Cu6Sn5 during thermal aging in Cu-xNi-yZn/Sn3.5Ag/Cu transient liquid-phase bonding;Materials Characterization;2024-01

3. Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review;Advanced Engineering Materials;2023-07-26

4. Copper-Based Nanomaterials for Fine-Pitch Interconnects in Microelectronics;Accounts of Chemical Research;2023-06-08

5. Defect formation and mitigation in Cu/Cu joints formed through transient liquid phase bonding with Cu-Sn nanocomposite interlayer;Microelectronics Reliability;2022-11

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